A heat sink device, for use with
specific power input at 100V and 20W to the heater, attached at the base plate
of copper, and then obtained the average temperature of Heat sink with the help
of 12 thermocouples. Two specimens of heat sinks were designed and were tested
for mass flow rate and heat transfer coefficient with base of
1mm&2mm&tip dimensions varying as 0.5mm, 1.00mm, respectively. By
experimenting and CFD simulations, optimization of heat sink design was done. Then,
correlation and validation were to be adopted.
